Leica Geosystems to present at Bau 2017

Logo Bau

Leica Geosystems will presents its latest innovations at Bau 2017 in Munich, Germany at Hall B6, Booth 411.

Bau is the world’s leading trade fair for architecture, materials and systems.

Key topics of the event are:

  • BIM: The future of planning
  • Digital construction industry and integral planning
  • Living and Building 2020

At this important exhibition we will be present with our latest innovations and integrated measurement solutions. How about a hands-on experience with our Leica DISTO™ S910 and its revolutionary P2P Technology? Measure anything from anywhere – no matter what shape, how complex or how hard to reach!

The combination of the Leica DISTO™ sketch and a DISTO™ makes your workflow even more efficient. To measure and document the results that can be used directly in your preferred software is today more important than ever before in a competitive environment. Find out more about the simplicity and amazing functionality of this solution at Bau 2017.

With the Leica DS2000 you can now bring all your underground tasks and data into one easy and convenient cloud interface. The Leica DX Manager gives you the control to update drawings, raw data, location pictures, data layers and mobile forms remotely in real time at an enterprise level.

There will be even more to come ---


전세계 고객이 라이카의 다양한 솔루션으로 변화를 실현하는 방법을 확인할 수 있습니다.


전세계 고객이 라이카의 다양한 솔루션으로 변화를 실현하는 방법을 확인할 수 있습니다.


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